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Aiming at the problems of high intensity and low efficiency of manual peeling of sweet potato, a technological scheme for adaptive cutter mechanism peeling of sweet potato was proposed based on the analysis of the shape characteristic of sweet potato. To ensure the consistency of sweet potato cutting thickness and the stability of peeling operation,，firstly, a theoretical analysis of the sweet potato peeling process was carried out, and the structural parameters and value ranges of key components that affected the peeling performance were determined. For further study of the improved working performance of mechanism peeling for sweet potato, the Box-Behnken experimental design with three factors and three levels was performed, parameters such as radius of profiling ball, profiling force and rotational speed ratio of electric cylinder and jaw were selected as independent variables, which would influence the thickness uniformity of sweet potato peeling. The mathematical model was established, and the main reasons that affected peeling performance were analyzed as well. The test results showed that effects orders of three parameters on the sweet potato obvious rate from primary to secondary were as follows: profiling force, roller ball size, profiling force and rotational speed ratio of electric cylinder and jaw. The optimal working parameters were forward profiling force of 68.1N and radius of profiling ball of 28.1mm and rotational speed ratio of electric cylinder and jaw of 0.95. Confirmatory tests showed that the sweet potato peeling machine had a better peeling effect，the average peeling time of single sweet potato was 10s, the working efficiency was 360 pieces/h, which can meet the design requirements of the sweet potato mechanical peeling with the optimized working parameters.